Agentic solutions across the semiconductor lifecycle

Accelerate execution from design verification through test readiness, silicon bring-up, and sustaining yield & quality—by automating triage, tightening release gates, and turning fragmented data into decisions.

3D semiconductor chip illustration
5–10×

Faster execution across the lifecycle

Silicon lifecycle process flow
End-to-end Silicon Lifecycle

Workflow acceleration at every stage

From design verification through field reliability, purpose-built agentic workflows automate investigations, decisions, and corrective actions across the entire silicon lifecycle — so your engineers focus on what matters most.

Design

Accelerate verification, debug, and signoff.

Key workflows
  • Spec-to-RTL generation
  • Verification speedup (functional, formal)
  • Timing closure debug

Ramp

COMING SOON

Compress learning loops from first silicon to volume readiness.

Key workflows
  • Test plan generation
  • ATE program validation
  • NPI test data analysis

Production

Detect, contain, and close the loop in production and the field.

Key workflows
  • Excursion detection & triage
  • Defect pareto analysis
  • Yield improvement
Semantic Data Fabric

Works above your existing stack — not instead of it

Data is at the core of the silicon lifecycle. Emergence unifies your structured systems with unstructured engineering knowledge, then activates that unified layer through agentic workflows — without replacing your EDA tools or yield platforms.

  • Integrates with OptimalPlus GO and other yield platforms
  • Connects EDA outputs, test systems, MES, QMS, and PLM
  • Captures unstructured knowledge: FA reports, tickets, SOPs, tribal knowledge
  • Human-in-the-loop with appropriate review and approval gates
Semantic Data Fabric - Emergence Platform integration diagram
Why Emergence

Workflow-first agents built for engineering execution

Not generic AI assistants. Purpose-built agentic systems trained on semiconductor domain knowledge, designed to deliver traceable results from day one.

Workflow-first agents

Each agent is purpose-built for specific engineering execution workflows — from regression triage to excursion containment — not generic chat that requires prompt engineering to get useful output.

Traceable outputs

Every output carries evidence links — waveforms, test logs, prior debug sessions — providing the auditability and repeatability that safety-critical semiconductor workflows demand.

Fast time-to-value

Start with 1–2 high-impact workflows and demonstrate ROI within weeks. Emergence is designed to scale incrementally across the full silicon lifecycle without a multi-year integration program.

Semiconductor Leadership

Built by Veterans in Semiconductors

Emergence is uniquely positioned to lead agentic AI for semiconductors because we sit at the rare intersection of (1) world-class agentic AI systems and (2) deep semiconductor execution experience.

Our team brings leadership backgrounds spanning IBM Research, IBM Microelectronics, and Broadcom, with experience across EDA and verification, silicon bring-up and production readiness, and advanced device/interconnect and packaging technologies. In parallel, we have led and contributed to benchmark-leading agentic AI research and systems, including work associated with Agent E, BIRD-SQL, HELM, and LongMemEval, as well as advances in recursive intelligence which are essential for building scalable, reusable automation across many semiconductor workflows.

Collectively, the team has:

  • Built and led agentic AI systems and evaluation efforts that push state of the art in tool use, long-horizon task execution, and memory-driven reasoning which are capabilities required to automate real semiconductor programs end-to-end.
  • Led advanced semiconductor technology programs at IBM Research and IBM Microelectronics, spanning interconnect innovations, advanced materials, device technology transitions (FinFET/ETSOI), and packaging.
  • Delivered major EDA/compiler optimization advances for ASIC and server-class chips, including a 50× Verilog compilation speedup recognized with an Outstanding Technical Achievement Award.
  • Supported FinFET adoption and chip bring-up at Broadcom, working closely with foundry partners and business units through critical ramp phases.
  • Produced a sustained record of invention and publication with 300+ papers and 200+ U.S. patents, including recognition such as IBM Master Inventor status, and major IEEE-level innovation awards.

Together, this combination, best-in-class agentic AI plus hard-earned semiconductor execution depth, is what enables Emergence to automate the entire semiconductor lifecycle: accelerating design, compressing NPI and ramp learning loops, and improving yield and field quality with enterprise-grade rigor.

Get in Touch

Ready to accelerate your semiconductor lifecycle? Let's talk.